By R.K. Willardson and Eicke R. Weber (Eds.)
Seeing that its inception in 1966, the sequence of numbered volumes referred to as Semiconductors and Semimetals has amazing itself throughout the cautious choice of recognized authors, editors, and participants. The Willardson and Beer sequence, because it is celebrated, has succeeded in generating a variety of landmark volumes and chapters. not just did lots of those volumes make an impression on the time in their booklet, yet they remain well-cited years after their unique liberate. lately, Professor Eicke R. Weber of the college of California at Berkeley joined as a co-editor of the sequence. Professor Weber, a well known specialist within the box of semiconductor fabrics, will additional give a contribution to carrying on with the sequence' culture of publishing well timed, hugely correct, and long-impacting volumes. a number of the contemporary volumes, resembling Hydrogen in Semiconductors, Imperfections in III/V fabrics, Epitaxial Microstructures, High-Speed Heterostructure units, Oxygen in Silicon, and others promise that this practice may be maintained or even expanded.Reflecting the actually interdisciplinary nature of the sphere that the sequence covers, the volumes in Semiconductors and Semimetals were and may remain of significant curiosity to physicists, chemists, fabrics scientists, and gadget engineers in glossy undefined.
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Extra info for Chemical Mechanical Polishing in Silicon Processing
D. L. Olmstead, US. Patent #5,193,316, issued Mar. 16, 1993. 30. H. Yui, Japanese Patent #6-91522, issued May 4, 1994. 31. A. S. Patent #5,449,316, issued Sept. 12, 1995. 32. H. Kobayashi, H. S. Patent #5,584,751, issued Dec. 17, 1996. 33. P. D. Jackson, S. C. S. Patent #5,643,061, issued July 1, 1997. 34. J. R. Breivogel, M. J. Prince, C. E. S. Patent #5,635,083, issued Jun. 3, 1997. 35. M. T. Sherwood, H. Q. Lee, N. Shendon, S. S. Patent #5,681,215, issued Oct. 28, 1997. 36. M. Leach, Semiconductor International, pp.
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Beaudoin, “Effects of carrier film physical properties on W CMP,” Submitted for publication in Thin Solid Films. 21. Y. Zhang, P. Parikh, P. Golobtsov, B. Stephenson, M. Bonsaver, J. Lee, M. Hoffman, “Wafer Shape Measurement and Its Influence on Chemical Mechanical Planarization,” Meeting Abstracts of the Fall Meeting of the Electrochemical Society, Abstract No. 250, pp. 629-630, San Antonio, TX, October 6-11, 1996. 22. G. Morsch, J. Lohmnller, E. Hartmannsgruber, Chemical-Mechanical Polishing Process Optimization: A Study Focused on Local Back Surface Pressure, Semiconductor Fabtech Edition.
Chemical Mechanical Polishing in Silicon Processing by R.K. Willardson and Eicke R. Weber (Eds.)