By Steinberg, Dave S.

ISBN-10: 0471524514

ISBN-13: 9780471524519

ISBN-10: 1601196350

ISBN-13: 9781601196354

This e-book info infallible innovations for designing digital to resist critical thermal environments. It additionally bargains mathematical modeling functions, utilizing analog resistor networks, to supply the breakup of complicated structures into a variety of person thermal resistors and nodes should you favor high-speed electronic machine strategies to thermal difficulties.

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**Extra resources for Cooling Techniques for Electronic Equipment**

**Sample text**

The sheet metal is made from rolled stock, so that it is not porous. However, the box corners may be welded and welds may leak. Cast structures are often very porous. Some magnesium and aluminum castings 1 in thick will not hold air for more than 5 min. Structures of this type can often be impregnated with an epoxy resin. The most effective technique for applying the resin is by means of a vacuum. The porous structure is placed in a vacuum chamber, the air is evacuated, and the resin is applied to the surfaces to be impregnated.

Sometimes the heat exchangers can be dip-brazed as an integral part of the chassis without first forming a subassembly. The multiple fins provide a large surface area, which sharply increases the amount of heat that can be removed from the chassis with air or with liquids. A typical cross section through a chassis with finned sidewall heat exchangers is shown in Fig. 1. 0203 cm) thick so that many fins can be spaced close together. The typical spacing is about 14 to 18 fins per inch. Some companies can dip-braze as many as 23 to 25 fins per inch.

This will result in a thermal analog resistor network, or mathematical model, which describes the thermal characteristics of that structural section of the electronic system. The basic conduction heat flow relation shown by Eq. 1 can be modified slightly to utilize the thermal resistance concept. The thermal resistance for conduction heat flow is then defined by Eq. 14 [24]. 14) Substituting this value into Eq. 1 results in the temperature rise relation when the thermal resistance concept is used, as shown in Eq.

### Cooling Techniques for Electronic Equipment by Steinberg, Dave S.

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